How can EPS equipotential bonding suppress common-mode current?

In an EPS system, equipotential bonding interconnects all conductive parts within the cabinet (chassis, metal supports, filter grounding terminals, equipment enclosures) using low-impedance conductors, making their potentials approximately equal. This effectively suppresses common-mode current:

1. Eliminates driving sources: Reduces the potential difference between different metal components caused by noise current flow, thereby weakening the voltage source driving common-mode current.

2. Provides a legitimate low-impedance path: Provides a pre-designed, low-impedance metal return path for high-frequency common-mode noise current, allowing it to flow locally within the cabinet rather than radiating out through external cables or space, thus reducing external interference and internal coupling.

3. Stabilizes reference points: Ensures that the grounding points of filters (especially Y capacitors) and shielding layers have a stable and consistent reference potential, allowing filtering and shielding effects to be fully realized. During implementation, copper braided tape or flat copper busbars should be used for multi-point shorting.