
The industrial AI edge gateway uses a galvanized steel plate or stainless steel shielded shell, providing 30-60dB of shielding effectiveness to effectively suppress high-frequency radiation from AI chips. Actual measurements show a 25dB reduction in radiated emission at 1GHz compared to the unshielded state. Design highlights include a shell seam spacing of <15mm and the addition of conductive foam for 25% compression, resulting in a contact resistance of <20mΩ. Ventilation holes utilize hexagonal honeycomb holes with a side length of <3mm. I/O interfaces employ shielded connectors with a 360° overlap with the shell. The conductive foam shielding effectiveness reaches 60dB. At 1GHz, a 3m anechoic chamber test showed a 6dB radiated emission margin at full load for the AI chip.