
Enclosure overlap continuity ensures low-impedance connections.
Surface contact is used: the insulating coating is removed from the contact surface.
Conductive gaskets are used: beryllium copper springs with a compression ratio of 30%-70%.
Screw fixing: spacing less than λ/20, consistent torque.
Bridging treatment: braided copper strips are used for bridging movable parts such as hinges.
Testing: overlap resistance is less than 15mΩ (DC).
By ensuring continuity, the overall enclosure shielding effectiveness is greater than 35dB.