11 countries participate in the Shanghai International Import Expo for the first time! Multiple companies in the semiconductor industry participated in the exhibition.

【The 6th China International Import Expo was held in Shanghai from November 5th to 10th. Foreign Ministry spokesperson Wang Wenbin stated at a regular press conference on the 3rd that this year's CIIE is expected to welcome guests from 154 countries, regions, and international organizations, attracting over 3400 exhibitors to register. Since the first CIIE was held in 2018, its "circle of friends" has continued to expand, and its "charm" in the world is becoming stronger and stronger. Many countries have sent their largest or highest level delegations to attend this year's CIIE. Leaders from multiple countries, including Australian Prime Minister Albanese, Cuban Prime Minister Marrero, Kazakhstan Prime Minister Smilov, and Serbian Prime Minister Brnabic, will attend the opening ceremony and related activities of the CIIE. The United States has sent a delegation led by a senior official for the first time, and Russia will hold more than 500 business conferences at this year's CIIE. On the 3rd, relevant experts stated in an interview with Global Times reporters that at a time when many regions of the world are facing geopolitical conflicts and crises, and the trend of "anti globalization" is constantly surging, the active participation of so many countries, enterprises, and guests in the CIIE is not only attracted by China's huge market and open policies, but also demonstrates the desire of various countries for open development and win-win cooperation. The CIIE is a microcosm of China's continuous expansion of high-level opening-up to the outside world, and sends a strong voice to promote inclusive growth of the world economy, "Wang Wenbin emphasized on the 3rd

Create numerous' firsts' and 'firsts'

Wang Wenbin stated at a press conference on the 3rd that the CIIE has facilitated the domestic circulation, linked the domestic and international dual circulation, showcased the new pulse of the Chinese economy to the world, injected pressure into the world economy, and provided an important platform for foreign enterprises to tap into the vast market potential of China.

Many numbers indicate that this year's CIIE will create numerous "firsts," "firsts," and "firsts in history. It is reported that in addition to welcoming guests from 154 countries, regions, and international organizations, as well as over 3400 exhibitors, more than 70 countries and international organizations have confirmed their participation in the national exhibition, covering five continents. Among them, 11 countries are participating for the first time, and 34 countries are participating offline for the first time. The spokesperson of the Ministry of Commerce previously stated that the exhibition area of enterprises reached a new high of 367000 square meters. The number of Fortune 500 companies, industry leaders, and innovative small and medium-sized enterprises participating in the exhibition is the highest in history.

The CIIE has set up a semiconductor zone in the technology equipment exhibition area, including Qualcomm ASML、 Texas Instruments, Canon, Nikon, Panlin, Samsung Electronics and other companies participated in the exhibition, covering multiple aspects such as semiconductor manufacturing equipment, wafer manufacturing, chip design, etc.

As a leading supplier in the global chip industry, ASML (ASML) will participate in the 5th China International Import Expo this year with various technologies such as lithography machines, computational lithography, and measurement, under the theme of "Lithography Future, Working Together", and continue to showcase in the Integrated Circuit Zone of the Shanghai National Convention and Exhibition Center Technology Equipment Exhibition Area.

During the 6th CIIE, ASML will showcase the "Iron Triangle" panoramic lithography solution: lithography machines equipped with advanced process control capabilities, computational lithography, optical and electron beam measurement.