Does bundling of internal wiring harnesses in a data center switch affect EMC?

The bundling method of internal wiring harnesses (power cables/signal cables/fan cables) in data center switches significantly affects EMC. Incorrect methods: mixing high-voltage and low-voltage cables; running high-frequency digital cables alongside analog audio cables. Correct practices: power cables and signal cables are routed separately with a spacing >20mm; high-speed differential cables are individually shielded and twisted; when crossing, they must be orthogonal at 90°; harness length redundancy <5%; excessively long harnesses are coiled into a figure-eight shape to reduce the loop area; harnesses are grounded near the chassis with a grounding impedance <10mΩ. Actual measurements showed that incorrect bundling caused a 12dB increase in radiated emissions at 200MHz; after optimization, Class B compliance was achieved.