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How can EMI leakage be reduced in the PCB vias of an intelligent low-voltage monitoring unit?

Time：2025-12-15 Views：503次

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PCB via design optimized to reduce EMI leakage. Signal via diameter is 0.25mm, pad diameter is 0.5mm, and anti-pad diameter is 0.8mm. Grounding vias are arranged around the signal via array with a spacing of 1.5mm. High-speed signal vias utilize back-drilling technology. Power vias are arranged in multiple parallel connections. The distance between vias and the board edge is greater than 2mm. Through this optimization, EMI leakage caused by vias is reduced by more than 18dB, meeting the IEC 61967-2 integrated circuit radiation test requirements.

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