Wuxi Zhongkexin: Manufacturing Platform Based on Wafer-Level Chip Scale Packaging Technology Mass Produced

According to the Wuxi Daily, the team from China Key System & Integrated Circuit Co., Ltd. (CKS) has successfully overcome key technologies in wafer-level redistribution and wafer-level bump preparation.

It is reported that the company's manufacturing platform based on wafer-level chip-scale packaging (WLCSP) technology has now achieved mass production and is providing manufacturing services to multiple domestic clients, filling the gap in this field in China.

China Key System & Integrated Circuit Co., Ltd. is a high-tech electronics enterprise established by China Electronics Technology Group Corporation (CETC). It possesses a complete industry chain covering integrated circuit design, mask making, process technology, testing, packaging, reliability, and application. Its product portfolio primarily includes FPGA, SoC/MCU, radiation-hardened devices, and application-specific products. The company serves as a core supplier of autonomous and controllable chips and solutions for national information systems and military equipment, a trusted public manufacturing platform service provider, and a key supplier of chips and information systems for emerging industries such as mobile communications, cloud computing, industrial control, and the Internet of Things.