News & Events

MOSFET (Metal-Oxide-Semiconductor field-effect transistor) is a common semiconductor device widely used in digital circuits, analog circuits, power electronics, and other fields. This article will explain the basic knowledge of MOSFET from aspects such as basic structure, working principle, and parameter characteristics.
1. Basic Structure of MOSFET
MOSFET is composed of three parts: Metal, Oxide, and Semiconductor. Its...

Classification by frequency: The most basic classification method. Diodes are classified according to their characteristics into rectifier diodes, switching diodes, Schottky barrier diodes, Zener diodes, and high-frequency diodes for high frequencies. Additionally, Zener diodes are generally used as protection components, but with the refinement of peripheral circuits and application miniaturization, higher-performance protection components — TVS (Transient Voltage Suppressor) are required.
 Classification by structure: Mainly divided into the current mainstream Planar type and mesa type for high voltage resistance.

According to the latest forecast from Semiconductor Intelligence, semiconductor capital expenditures (CapEx) will decrease by 14% in 2023, with the storage industry experiencing the largest reduction of 19%. In recent years, the PC and smartphone markets have remained sluggish without any signs of improvement, and the storage industry has been severely affected. In addition to significant spending cuts by storage companies, contract manufacturers will also reduce capital expenditures by 11% in 2023, TSMC by 12%, UMC by 2%, and Gexin by 27%. IDM manufacturers have reduced their capital expenditures by 7%, with Intel planning to cut by 19%. Texas Instruments, STMicroelectronics, and Infineon have risen to the challenge and increased their capital expenditures in 2023, with the automotive and industrial related markets making the main contribution. The decline in the personal computer market has affected Intel and memory companies, while the weakness in the smartphone market has affected TSMC and memory companies. Apple and Qualcomm are TSMC's two largest customers.

The maximum requirement of 30 KV in JEDEC is because it is a common electrostatic discharge (ESD) voltage limit.
ESD is an electrostatic discharge that occurs between two objects, which may damage electronic equipment or cause data loss. Therefore, to ensure device reliability and stability, JEDEC established the 30 KV electrostatic discharge standard. This standard is based on actual testing and experience, ensuring that devices are not subject to unacceptable electrostatic discharge effects during normal operation and use.

JEDEC has established several standards for electrostatic discharge (ESD) in electronic chips, mainly including the following...

Overview of SiC Power Devices
SiC (Silicon Carbide) power devices, with their characteristics of high temperature resistance, high voltage resistance, and low switching losses, can effectively achieve requirements such as high efficiency, miniaturization, lightweight, and high power density in power electronic systems, and are highly sought after in fields such as new energy vehicles, photovoltaic power generation, rail transportation, and smart grids.
In automotive applications, the significant advantages of SiC power devices in energy conversion efficiency can effectively increase the driving range and charging efficiency of electric vehicles. Additionally, SiC devices have lower conduction resistance, smaller chip size, and higher operating frequency, enabling electric vehicles to adapt to more complex driving...

On July 19th, the China Semiconductor Industry Association issued a statement on maintaining the global development of the semiconductor industry. The full text is as follows:

Global chip experts believe that talent shortage is the main obstacle to growth. With the weakening of global economic growth, politicians and universities in various countries are eager to make the most of it, which has a significant impact on the funding sources of research institutions.

From July 11th to 13th, the Munich Shanghai Electronics Show (electronica China) was grandly held at the National Exhibition and Convention Center (Shanghai). Yin Te Electronics, as an important power device manufacturer, participated in this exhibition.

A key strategy of the fully autonomous vehicle is to be able to fuse inputs from multiple sensors, which is crucial for making safe and reliable decisions. However, it has proved to be much more difficult than initially thought. There are many issues that need to be addressed, including how to divide, prioritize, and ultimately combine different types of data, as well as how to construct internal processing for the vehicle so that it can quickly make decisions based on these different data types to avoid accidents. There is no single best practice for achieving this goal, which is why many automotive original equipment manufacturers have taken vastly different approaches.