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The semiconductor industry policies and export controls, such as the US Chip and Science Act, are important economic and trade concerns for China, and also key issues raised by Minister Wang Wentao during his talks with the US.

Recently, Zhang Lin, the county mayor of Xinfeng County in Jiangxi Province, and her delegation visited Yinte Electronics for a visit. General Manager Xiao Nanhai, Deputy General Manager Xiong Dengfeng, and EMI Business Unit General Manager Deng Shaoneng received County Mayor Zhang and his delegation.

According to foreign media reports, under pressure from the United States, China will launch a large-scale plan to support its semiconductor industry in order to achieve self-sufficiency in chips. Sources have revealed in detail China's next steps. According to foreign media reports on Tuesday (December 13th), three sources said that China is developing a support plan worth over 1 trillion yuan (143 billion US dollars) to support the development of the semiconductor industry. According to sources, this is one of the largest fiscal incentive plans planned by the Chinese government within the next five years, mainly to support domestic semiconductor production and research and development through subsidies and tax credits. The analyst said,

According to the report of the Nihon Keizai Shimbun on November 7, November 8 on the reference news website, the Expo being held in Shanghai, China has attracted large US semiconductor enterprises and manufacturing equipment giants to participate. The Biden administration's semiconductor restrictions on China are intensifying US China relations, but for businesses, China is an indispensable market for profit. Outside of the semiconductor industry, major American companies such as Microsoft, Dell, and Metaverse Platform have participated in the exhibition. While promoting their own metaverse technology, various companies are also committed to providing support for Chinese enterprises to expand into overseas markets. According to reports, the Biden administration has also requested its allies to align with China's semiconductor restrictions, but like American companies, European and Japanese companies have also benefited greatly from China. In addition to ASML Holdings from the Netherlands participating in the exhibition, Canon and Nikon from Japan also brought their own semiconductor manufacturing equipment. According to the report, the relevant person in charge of the American semiconductor manufacturing equipment giant Panlin Group, who participated in this year's CIIE, warmly introduced their company's achievements and product advantages in China to corporate clients who came to inquire at the booth on the 6th: "We have been committed to promoting breakthroughs in the new generation of semiconductor technology Another industry giant, Koley Corporation of the United States, also participated in this year's exhibition. Previously, it was reported that due to the US government's increased export restrictions on China, these two American companies have suspended technical support for some Chinese companies. However, according to the staff at the booth, as long as it does not involve cutting-edge technology, they can still conduct business in China. According to reports, the American semiconductor companies participating in this exhibition include AMD, Intel, Texas Instruments, etc. The main exhibits are automotive and network semiconductors, which have attracted the attention of many Chinese companies.

According to sources cited by The Wall Street Journal, TSMC is considering expanding its production capacity in Japan. According to sources, the Japanese government hopes that TSMC will expand beyond its already operational factories. At present, TSMC is studying feasibility and has not yet made an initial decision. Another source familiar with the matter said that TSMC will consider producing more advanced chips in Kyushu, Japan. Currently, TSMC is building a chip manufacturing plant in Kyushu, Japan. This multi billion dollar factory has received subsidies from the Japanese government. This factory was originally planned to mainly produce chips for mature processes of automobiles and sensors, with plans to ship them by the end of 2024. TSMC considers expanding its production capacity in Japan to produce advanced process semiconductors

Recently, Yin Te Electronics received a notification from the State Grid Metrology Center that the products submitted for inspection by our company have passed the testing of the State Grid and issued an official report. State Grid Corporation of China is proposing stricter industry standards for electronic equipment and related electronic components entering the industry to ensure the efficient, stable, and safe operation of State Grid.

Sharp tools make good work. In the modern management of enterprise production, enterprises must rely on improving their modern management level, enhancing production efficiency, and continuously expanding and strengthening in order to stand invincible. However, in order for enterprises to truly stand out in the fierce market competition and seek greater development, in addition to their own transformation and upgrading, it is very important to introduce new production and testing equipment, improve the modernization of production and testing equipment, enhance technological research and development capabilities, improve production quality, and strengthen service capabilities, in order to enter a new stage of development for the enterprise. Entering the laboratory of Yin Te Electronics, the newly introduced testing equipment has been debugged. These high-tech research equipment improve production efficiency, make test results more accurate and objective, ensure that products are safely delivered to customers, and give them peace of mind and satisfaction. Yinte Electronics adheres to the business philosophy of "striving for excellence and putting customers first", and strives to provide customers with more comprehensive and high-quality services.

On September 27, 2022, California time, SEMI announced in its latest quarterly World Fab Forecast that global fab equipment spending is expected to increase by approximately 9% year-on-year in 2022, reaching a historic high of $99 billion. After reaching record levels in 2022, it is expected that the global wafer fab equipment market will continue to maintain healthy development next year, driven by the construction and upgrading of new wafer fabs, "said Ajit Manocha, President and CEO of SEMI It is estimated that Taiwan, China will lead the expenditure on wafer factory equipment in 2022, with an increase of 47% year-on-year to 30 billion US dollars. Next is South Korea, reaching 22.2 billion US dollars, a decrease of 5.5%. China's value is 22 billion US dollars, a decrease of 11.7% from last year's peak. It is expected that expenditures in the Europe/Middle East region will reach a record high of $6.6 billion this year, a year-on-year increase of 141%. Despite relatively low expenditures compared to other regions, strong demand for advanced high-performance computing (HPC) technologies is driving a surge in expenditures in the region. It is expected that investment in the Americas and Southeast Asia will also reach historic highs in 2023. The semiconductor industry's production capacity continues to increase According to the SEMI World Fab Forecast, global production capacity is expected to increase by 7.7% this year, following a 7.4% growth in 2021. The last time wafer fab equipment experienced an 8% year-on-year growth was in 2010, when the monthly production capacity exceeded 16 million wafers (equivalent to 8 inches), which is approximately half of the expected 29 million wafers per month in 2023. It is expected that production capacity will continue to grow by 5.3% in 2023. In 2022, the capacity growth of 167 wafer fabs and production lines will account for over 84% of equipment expenditure. With the increase in capacity of 129 known wafer fabs and production lines, it is expected that this proportion will decline to 79% next year. As expected, the Foundry segment will account for 53% of device spending in 2022 and 2023, followed by memory, which will account for 32% and 33% respectively. These two areas have the largest increase in production capacity. The latest World Fab Forecast report released this time lists 1453 factories and production lines worldwide, including 148 factories and production lines expected to start production in 2022 or later.

Yin Te Electronics has developed a TVS device for 5G application scenarios, which provides a clamping voltage lower than the avalanche voltage but higher than the rated operating voltage. The LSPD6/LSPD10 series provides excellent clamping characteristics. Therefore, any boost caused by current conduction can be suppressed to the lowest level, providing optimal protection. In addition, the component can be connected in series and/or parallel to create a solution with various functions and flexible protection. The base station power line protection device helps to avoid service interruptions to users, improve system reliability, and reduce maintenance costs. Wireless network base stations require protection against overvoltage and overcurrent caused by lightning, power line accidents, and other interferences. Base stations are often located in remote and lightning prone areas, where quick and effective maintenance is difficult and expensive. Using appropriate protective circuits and devices will reduce the risk of damage. Risks and Protection of Power Input Lines The main sources of danger for wireless network base stations are lightning and power failures. Directly striking or approaching the transmission tower can generate high voltage and cause huge currents to flow through the transmission line. Similar impacts can cause short circuits and switch transients in high-voltage transmission lines. The damage caused by this will result in repair time, service downtime, and customer interruption. The most suitable protective measures for these transmission lines are to install fuses and high-power TVS diodes in the AC distribution box.