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Human movement, interface plugging/unplugging, and air friction; static electricity is everywhere, with voltages reaching thousands or even tens of thousands of volts; Its characteristics include low energy, high peak current, and extremely short rise time, targeting the weak points of electronic components; USB ports, HDMI ports, audio ports, power interfaces, and other "gateways" in contact with the outside world are the first line of defense.

Introduction: The Silent Guardian
In the dark corners of the electronic world lurks an invisible killer —— electrostatic discharge (ESD); It can instantly release energy, causing equipment malfunction or even “burning” chips; At this moment, a silent guardian steps forward: the ESD electrostatic diode; It acts like the most loyal bodyguard at the circuit entrance, silently absorbing all dangerous energy impacts. But how do you choose a reliable “bodyguard”? Understanding its “performance parameters” is key.
一、 Core...

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ESD Diodes: The Invisible Guardians of Electronic Devices. In today’s increasingly precise electronic devices, electrostatic discharge (ESD) has become a major threat to circuit reliability. A tiny static pulse is enough to damage fragile integrated circuits. ESD diodes, as specialized semiconductor devices for electrostatic protection, provide a low-impedance discharge path on sensitive signal lines or power lines, safely dissipating dangerous ESD energy to the ground, thereby protecting the core chips. Understanding their core parameters is key to proper selection and application. In-Depth Analysis of Five Core Parameters. Choosing a suitable ESD diode...

Exploring ESD Electrostatic Diodes: The Art of Balancing Depth and Speed in Chip Dicing Process. In the back-end process of semiconductor manufacturing, chip dicing is a critical step in cutting wafers into individual chips. For devices like ESD (Electrostatic Discharge) protection diodes, which have extremely high requirements for performance and reliability, parameter control in the dicing process, especially dicing depth and speed, directly affects the final product quality, yield, and even service life. This is not just simple cutting, but a precise balancing art. Dicing Depth: Ensuring Separation and Protecting Structural Balance. Dicing depth mainly refers to the cutting blade penetrating the wafer...

OPEN Alliance was established in 2011, focusing on the standardization of automotive Ethernet CML3225A-201T for common mode inductors

What is the difference between the forward conduction voltage VF of ordinary diodes and the forward breakdown voltage VBR_forward of ESD protection diodes?
First: Ordinary diode VF: The threshold voltage for PN junction conduction under forward bias (silicon diode ≈0.7V). After conduction, current increases slowly with voltage, no "breakdown" characteristic. Damage occurs when forward current is excessive due to thermal dissipation
ESD tube VBR_forward: The voltage at which avalanche breakdown occurs under forward bias. After breakdown, current surges sharply (e.g., when VBR_forward=6V)

The protocol is a digital communication standard designed specifically for point-to-point data transmission between sensors and ECU (Electronic Control Unit) in the field of automotive electronics. Its full name is the Single Edge Nibble Transmission protocol The core specification is based on SAE J2716 (the latest version being SAE J2716-201604 released in 2016) and is one of the key technologies for digital transmission of sensors in modern automobiles 1.  The application scope continues to expand Global SENT Protocol Transmission by 2025

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