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Celestial AI, based in Santa Clara, California, USA, is the creator of photonic structures. The company received $100 million in Series B funding, led by IAG Capital Partners, Koch Disruptive Technologies (KDT), and Temasek's Xora Innovation Fund. Other major investors in this round of financing include Samsung Catalyst, Smart Global Holdings (SGH), Porsche Automobile Holding SE, the Engine Fund, and imec. Expansion, M Ventures, and Tyche Partners. The optical connectivity performance level provided by Celestial AI's photonic structure technology platform is reportedly ten years ahead of existing technology products. Celestial AI states that the era of electronic connections limiting data transmission is coming to an end, as optical interconnects become the fundamental building blocks for accelerating computing. Today's advanced artificial intelligence (AI) models require exponential growth in memory capacity and bandwidth, as large language models (LLMs), including GPT-4 used for ChatGPT and recommendation engines, are memory constraints rather than computational constraints. Cloud service providers (CSPs) and hyperscale data centers are unable to separate memory expansion from computing (often referred to as the "memory wall" challenge). Low bandwidth, high latency, and high-power electrical interconnection are important obstacles to the growth of profitable business models and progress in artificial intelligence. Therefore, Optical Computing Interconnection (OCI) is considered the only feasible solution for implementing scalable data center memory decomposition and accelerating computation. In addition, the pool storage system of optical interconnection solves the biggest factor causing low economic efficiency in data centers - stranded memory. After closely collaborating with hyperscale, artificial intelligence computing, and memory providers, Celestial AI has launched Photonic Fabric, an optical interconnect for decomposition, billions of computations, and memory clusters. It is said that the photonic structure is not constrained by the packaging seaside restrictions and can transmit data to any location on the computing chip, directly to the consumption point. The bandwidth provided by photonic structures is 25 times higher than any alternative optical interconnect solution, such as co packaged optical devices (CPO), with latency and power consumption reduced by more than 10 times. Dave Lazovsky, founder and CEO of Celestial AI, stated, "Generative artificial intelligence and recommendation engines running on general-purpose computing systems are starting to have a significant impact on business processes, products, and services." "With the global data center infrastructure shifting from general-purpose to accelerated computing systems, there will be a rapid transformation in the coming years. The architecture of the next wave of data center infrastructure aims to achieve the decomposition of memory and computing resources through optical interconnects, making significant progress in AI workload efficiency Celestial AI is building a powerful photonic structure ecosystem consisting of AI computing, memory suppliers, hyperscale suppliers, and a large number of commercial supply chain partners. This technology is compatible with existing industry standards, including CXL, PCIe, UCIe, JEDEC HBM, and proprietary electrical communication links. Celestial AI offers its photonic structure optical interconnect technology and silicon validated IP through a technology licensing program. Celestial AI has developed a transformative optical connectivity capability that will achieve a leap forward in performance and energy efficiency in high-performance computing, unleashing the potential of native AI and other complex workloads, "commented Chase Koch, founder and CEO of Koch Disruptive Technologies. He believes that "this may be a truly disruptive moment for advanced computing Celestial AI provides a set of photonic structure technology solutions to provide independent computing and memory resource scalability. Customers can extend their existing computing platforms (GPUs, CPUs, and accelerators) with photonic structures through authorized IPs, or utilize the full end-to-end advantages of photonic structures through Celestial AI's Orion AI Accelerator. The photonic structure also supports the production deployment of the industry's first optical interconnect high-capacity, high bandwidth combinable storage system. News: Optoelectronics

ESD: Electrostatic Discharge
TVS: Transient Voltage Suppressors
The difference between TVS tubes and ESD tubes is: their working principles are the same, but their power ratings and packaging are different; ESD is mainly used for electrostatic protection, which requires low capacitance value; TVS cannot achieve this, as TVS has relatively high capacitance value.
Transient Voltage Suppressor Diodes (Transient Voltage Suppress...

Recently, after expert review, online publicity, and review procedures, Shanghai Yinte Electronics Co., Ltd. has been officially recognized as a patent pilot enterprise in Songjiang District, Shanghai. Patent pilot enterprises refer to the qualifications of enterprises established to promote patent work, fully leverage the role of the patent system in promoting technological innovation and enhancing core competitiveness, and strive to improve the quality of intellectual property creation, protection effectiveness, application efficiency, and management level of enterprises. The intellectual property strategy of the enterprise to some extent demonstrates its innovation capability, and our company's recognition as a patent pilot enterprise is undoubtedly a recognition of the layout and management of the enterprise's intellectual property, with high value. In the future, Yin Te Electronics will continue to adhere to the intellectual property strategy of independent innovation, rely on a strong technology platform, focus on high-value intellectual property creation, systematically enhance the company's technological innovation capabilities, and provide strong impetus for the company's sustainable development.

          Due to the need to improve performance and cost constraints, new materials, platforms, and designs are constantly being researched in the semiconductor industry. In the past decade, some compound semiconductors, such as gallium arsenide (GaAs) for radio frequency (RF) and silicon carbide (SiC) for power electronics, have successfully competed with silicon and entered the mass market. So, which emerging semiconductor substrate will be the next game changer? In its latest report; Emerging semiconductor substrates 2023&

Atsuyoshi Koike, CEO of Rapidus, stated in an exclusive interview with EE Times in Brussels that Rapidus will receive push from Japan's CHIPS Act and IBM to launch the only semiconductor foundry in Japan that manufactures the world's most advanced silicon, only two years behind industry giant TSMC. Xiaochi and his team of over 100 people are taking on a once-in-a-lifetime challenge. Xiaochi is a veteran in the chip industry and has recently worked at Western Digital

How far can RISC-V design go with compatibility? The answer is not always clear-cut, as the concept of RISC-V is very different from previous open source projects. However, as interest and activity towards RISC-V continue to grow, constructive discussions are underway to address some of the challenges in designing open standard ISA. Mark Himelstein, Chief Technology Officer of RISC-V International, said:; The RISC-V standard is compatible. “ However, we usually do not use‘ both

On June 17th, the 2nd China Nansha International Integrated Circuit Industry Forum (2023 IC NANSHA), organized by Xinmou Research, opened in Nansha, Guangzhou. According to the Daily Economic News, Professor Wei Shaojun from the School of Integrated Circuits at Tsinghua University attended the forum and delivered a speech The keynote speech on "Re globalization of the Semiconductor Industry".

The basic principle of plasma formation involves heating matter to a sufficiently high temperature to ionize it, dissociating electrons from atoms or molecules to form free electrons and positively charged ions. The following are the main steps of plasma formation:
1. Heating: Matter is heated to a sufficiently high temperature. High temperature can be provided through electric shock, high-energy light, or thermal energy, etc.
2. Ionization: High temperature gives atoms or molecules of matter enough energy, triggering ionization. In this process, electrons bound in atoms or molecules are dissociated, forming free electrons and positively charged ions.
3. Electrical neutrality: In...

The basic principle of ohmic contacts for N-type silicon carbide and P-type silicon carbide is to establish electrical connections with as low contact resistance as possible through appropriate electron transfer between metal materials and silicon carbide materials.

For N-type silicon carbide, its conductivity is mainly contributed by additional free electrons. When metal contacts N-type silicon carbide, free electrons in the metal can easily enter N-type silicon carbide, forming electron injection, making silicon carbide form low-resistance contact.


For P-type silicon carbide, its conductivity is mainly contributed by holes. When metal contacts P-type silicon carbide, free electrons in the metal and P-type silicon carbide...