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The basic principle of plasma formation involves heating matter to a sufficiently high temperature to ionize it, dissociating electrons from atoms or molecules to form free electrons and positively charged ions. The following are the main steps of plasma formation:
1. Heating: Matter is heated to a sufficiently high temperature. High temperature can be provided through electric shock, high-energy light, or thermal energy, etc.
2. Ionization: High temperature gives atoms or molecules of matter enough energy, triggering ionization. In this process, electrons bound in atoms or molecules are dissociated, forming free electrons and positively charged ions.
3. Electrical neutrality: In...

The basic principle of ohmic contacts for N-type silicon carbide and P-type silicon carbide is to establish electrical connections with as low contact resistance as possible through appropriate electron transfer between metal materials and silicon carbide materials.

For N-type silicon carbide, its conductivity is mainly contributed by additional free electrons. When metal contacts N-type silicon carbide, free electrons in the metal can easily enter N-type silicon carbide, forming electron injection, making silicon carbide form low-resistance contact.


For P-type silicon carbide, its conductivity is mainly contributed by holes. When metal contacts P-type silicon carbide, free electrons in the metal and P-type silicon carbide...

Main differences between unipolar power diodes and bipolar power diodes
lie in their different structures and working principles

In terms of main applications, unipolar power diodes are usually used in high-frequency applications such as switching power supplies and inverters, while bipolar power diodes are mainly used in rectification, driving, and protection circuits in power electronic applications.
In terms of device figure of merit, unipolar power diodes usually have lower turn-on voltage drop and faster switching speed, suitable for high-frequency applications. Bipolar power diodes often have higher reverse withstand voltage and larger current carrying capacity, suitable for high-power applications

Fast Recovery Diodes (FRD) in solar inverters mainly serve for reverse current conduction and preventing voltage reflection. Usage precautions for fast recovery diodes are as follows: 1. When designing inverters, appropriate fast recovery diodes need to be selected to ensure parameters such as rated current and voltage meet inverter operating requirements. 2. Ensure normal heat dissipation conditions for fast recovery diodes; in high-temperature environments, reasonable heat dissipation measures are needed to prevent failure due to overheating. 3.&nbs

Failure modes that may occur in MOSFETs in PV optimizers include the following: 1. Power MOSFET overheating: If power MOSFETs work under high load for a long time, device temperature may become too high, exceeding its rated temperature range, leading to failure. 2. Rough switching: When power MOSFET switching frequency is high, current interruption or flickering phenomena may occur during the switching process due to insufficient charge accumulation inside the device, called rough switching. Long-term rough switching operation may cause MOSFET failure. 3.&nbs

Silicon carbide ion implantation is a technology used to introduce specific impurity atoms into silicon carbide material. Ion implantation usually involves injecting the required dopant into silicon carbide crystals using high-energy ion beams. The ion implantation process includes the following steps: 1. Select the target impurity atoms to be implanted, usually boron (B), nitrogen (N), or phosphorus (P), etc. 2. Prepare silicon carbide substrates and film layers to carry and protect the ion implantation process. 3. Use an ion implanter to introduce high-energy ion beams into silicon carbide material. The ion beam passes through the film layer and implants into the silicon carbide crystal. 4.&

Planar MOSFETs and super-junction MOSFETs are two different MOSFET structures with some differences. 1. Structural differences: - Planar MOSFET: The most common MOSFET structure, consisting of three main regions: gate, channel, and drain. There is an insulating layer between the gate and drain used to control channel conductivity. - Super-junction MOSFET: A specially designed MOSFET with an additional special structure, the super junction. The super junction structure is usually formed through thin film deposition...

Silicon Carbide MOSFETs (Metal-Oxide-Semiconductor Field-Effect Transistor) have higher breakdown electric field strength and lower leakage current compared to traditional silicon MOSFETs, thus to some extent can better withstand electrostatic problems. However, to further solve electrostatic problems, the following are common methods: 1. Design appropriate protection circuits: Perform electrostatic protection design at the input and output ends of MOSFETs, such as using TVS diodes or static...

In MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistors), there is a certain relationship between current and voltage. MOSFET current is related to gate voltage and drain voltage, which can be described by the following key parameters: 1. Threshold voltage (Vth): When the gate voltage is greater than or equal to the threshold voltage, the MOSFET begins to conduct. Below Vth, the MOSFET is in cut-off state, with very small conduction current. 2. Turn-on voltage (Turn-On