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Deepening Industry-Academia-Research Integration: Shanghai University of Engineering Science Faculty and Students Visit Inte Electron, Exploring New Applications in Materials Science
2025-11-29
Deepen the integration of industry and education, break down the wall between theoretical teaching in universities and practical application in enterprises, and enable future engineers to have zero distance exposure to cutting-edge technologies in the electronic components industry
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Significant progress has also been made in gallium nitride (GaN) technology
2025-05-28
Significant progress has also been made in gallium nitride (GaN) technology The team led by Professor Cui Peng and Professor Han Jisheng from the Institute of New Generation Semiconductor Materials at Shandong University has developed a new GaN high electron mobility transistor (HEMT) with a crystalline silicon nitride (SiN) cap layer. Compared with traditional devices, this device has a 41% increase in saturation current and a 30% increase in breakdown voltage. The team has grown a 2nm crystalline SiN cap layer on an AlGaN barrier layer for the first time through in-situ growth technology, reducing the interface state density, effectively suppressing peak electric field distribution, simplifying the process flow, and saving costs. It has important application potential in GaN power switches and high-power microwave fields. These technological breakthroughs indicate that semiconductor power devices are accelerating towards high performance and high reliability, which will effectively promote technological upgrading and industrial transformation in multiple industries such as new energy vehicles, aerospace, and communications. With continuous investment in research and development and collaborative innovation in the industrial chain, power device technology is expected to make more breakthroughs in the future, providing strong support for global technological development https://dpt.sdu.edu.cn/info/1037/3395.htm
The Japan Korea exhibition successfully closed, thanks to the guidance of the leaders and the win-win interaction with the customers
2025-05-17
On May 13-14, 2025, the company successfully held an exhibition at the Goyang Exhibition Center in South Korea. Secretary Wang Huajie of the Songjiang District Committee personally visited South Korea to guide the company's overseas business expansion and provide a platform for the enterprise On May 8-9, 2025, Yin Te Electronics will cross mountains and seas to showcase the company's focus and innovation in Osaka, Japan; The management of the company attaches great importance to this exhibition trip to Japan. From the preparation of exhibits to technical explanations, every detail embodies the wisdom and care of the leadership team, laying a solid foundation for the smooth development of the exhibition! At the exhibition site, sound
WSTS data reflects significant signs of recovery in the global semiconductor industry
2025-05-04
According to the World Semiconductor Trade Statistics Organization (WSTS), global semiconductor sales reached $627.6 billion in 2024, a year-on-year increase of 19.1%. The organization predicts that the growth rate of the global semiconductor market will fall back to 11.2% by 2025, and the global market valuation will reach approximately $697 billion
Non EUV technology route, the world's first two-dimensional processor "Wuji" has been launched
2025-05-04
Recently, the team led by Zhou Peng and Bao Wenzhong from Fudan University developed the world's first 32-bit RISC-V architecture microprocessor based on two-dimensional semiconductor materials; Infinite” (WUJI) appeared on the cover of Nature magazine; The processor integrates 5900 transistors and has completed independent research and development of the entire chain from materials to architecture to chip fabrication through a unique integrated process of independent innovation. Implementing multi bridge channel transistor technology with enclosed gate: For 3-5 nanometer node transistor technology, Zhou Peng's team verified that the double-layer channel thicknesses were 0.6/1.2 nanometers, respectively
Overview of Common Communication Protocol Common Mode Inductors and Electrostatic Protection Devices
2025-05-02
Overview of Common Communication Protocol Common Mode Inductors and Electrostatic Protection Devices
Protocol
Protocol
Speed/rate
Speed
ESD S/N
ESD Protection Model
Packing Size
Package
CML S/N Common Mode Inductor Model
Packing Size Package
GMSL
12Gbps
List of Communication Interfaces for Industrial&Automotive Industries
2025-05-02
Industrial interface communication one Modbus It is an application layer protocol widely used in industrial automation systems, supporting serial communication and TCP/IP network communication, commonly used in instruments and meters RTU、 Process automation and other fields two PROFIBUS It is a fieldbus standard used in the field of industrial automation, supporting multiple communication rates and topologies, promoted by companies such as Siemens, and widely applied in the field of process automation three Profinet Industrial communication protocol based on Ethernet, widely used in industry
The tariff friction between China and the United States can be completely replaced by the CAN bus common mode inductor, which can be replaced by CATL
2025-04-09
One Yin Te CML4532-510T completely replaces the following materials Brand Part Number Wü rth Elektronik seven hundred and forty-four million two hundred and forty-two thousand five hundred and ten TDK &nb
Global semiconductor companies
2025-04-07
Global semiconductor commonly used enterprise websites NVIDIA:https://www.nvidia.com/ TSMC:https://www.tsmc.com/schinese Broadcom:http://brocadechina.org/ ASML:https://www.asml.com/zh-cn Samsung:https://www.samsung.com/cn/ QUALCOMM:htt
New product release: SMBJ1505CA protection SIC Mosfet
2025-04-02
As a new type of power semiconductor device, the SIC MOSFET has been widely applied in new energy vehicles, photovoltaics, smart grids, and other fields in recent years, driven by the maturity of its technology. With its notable advantages such as fast switching speed, low on-resistance, and high temperature resistance, it has gradually become a powerful alternative to traditional silicon-based devices
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