News & Events

Our company participated in the 2019 China (Chengdu) Electronic Information Expo from July 11th to 13th, 2019, with booth number 4C254. We welcome new and old customers to visit and guide us!

Wuxi Daily reported that the team of Zhongkexin Integrated Circuit Co., Ltd. successfully overcame key technologies of wafer-level redistribution and wafer-level bump preparation. According to reports, the company's manufacturing platform based on wafer-level chip scale packaging technology has been mass-produced, providing manufacturing services for multiple domestic customers, filling the current gap in this field in China. Zhongkexin Integrated Circuit Co., Ltd. is a high-tech electronic enterprise established by China Electronics Technology Group Corporation, with a complete industrial chain including integrated circuit design, mask making, process, testing, packaging, reliability, and application. Products include FPGA SoC/MCU, radiation-resistant and...

Today, Huahong Semiconductor officially announced that its third-generation 90nm embedded flash (90nm eFlash) process platform has been successfully mass-produced.
According to reports, the Flash cell size of the third-generation 90nm embedded flash process platform is nearly 40% smaller than the second-generation process, setting a global record for the smallest size of embedded flash technology at the 90nm process node for foundries. The Flash IP has more area advantages, and the number of mask layers is further reduced. At the same time, in terms of reliability indicators, it can achieve 100,000 erase/write cycles and 25-year data retention.

Huahong Semiconductor...

ZTE and Huawei, as China's two major communications industry giants, have remarkable achievements in the 5G era, which is undeniable. Currently, both technology giants have invested substantial human, material, and financial resources in 5G research. After the three major operators successively announced the launch time of 5G phones, these two giants also announced their 5G commercial achievements. In this 5G era, who will be the final winner? We will wait and see.
In the mobile communications industry, both Huawei and ZTE are leaders. Recently, ZTE also released its 5G commercial achievements. Judging from the released results, ZTE has gradually emerged from the U.S. suppression incident...

Backup Strategy At the beginning of 2018, Hua Zheng from HiSilicon Shanghai R&D Institute participated in the department's Spring Festival symposium, summarizing the past fiscal year and listing the revenue of various departments and projects. He found that an optical communication chip project had only a tiny bit of revenue, negligible. This chip is used in backbone switches, with very little demand but high R&D costs. “From our perspective, it seems meaningless. This project must lose a lot of money. Just one tape-out costs over 20 million yuan.” Hua Zheng said, and a chip needs 3-4 tape-outs before mass production. Hua...

U.S. chip manufacturer Broadcom.
U.S. chip manufacturer Broadcom is facing a formal antitrust investigation by the EU.
On June 26, the European Commission announced on its website that the EU antitrust department will investigate whether Broadcom used exclusive restrictive means to hinder competitors in the TV and modem chip markets, violating EU regulations.
Reuters reported that the investigation may lead to heavy fines for Broadcom and termination of the above behaviors.
The European Commission (European Commission) stated that it plans to take...

Due to well-known reasons, everyone has been trying to find domestic chip companies recently, wanting to see how good their chip levels are and whether they can become Huawei's "backup." At the same time, someone counted and said that from 2010 to 2018, domestic IC design has grown from 582 to 1698 companies, a threefold increase in number, indicating that domestic chip development has been very fast in recent years, and everyone attaches great importance to it.     So with so many chip companies, what are their chip levels?

In order to share as much as possible the application solutions and verification data of Yin Te Company over the past decade with everyone; After careful organization led by Dean Yan Xinfa of the Yin Te Electronic Technology Research Institute, it has been officially classified; Open to the public, welcome corrections! USB3.0保护方案 汽车电子保护方案设计参考 汽车电子保护器件应用对照

In order to share as much as possible the application solutions and verification data of Yin Te Company over the past decade with everyone; After careful organization led by Dean Yan Xinfa of the Yin Te Electronic Technology Research Institute, it has been officially classified; Open to the public, welcome corrections!