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New Energy Vehicle Ethernet Protection

With the rapid advancement of new energy vehicle technology, traditional industrial Ethernet technology is also being widely used in the automotive industry. Automotive Ethernet provides the automotive industry with topology flexibility, high bandwidth, and anti-interference communication, making it an inevitable trend for the development of intelligent connected vehicles. In 2016, the IEEE standardized the automotive Ethernet system 100BASE-T1 and 1000BASE-T1 developed by the Ethernet Alliance Committee to meet specific requirements of automotive applications, especially in terms of electromagnetic interference (EMI) and electromagnetic compatibility (EMC).

On November 12, 2024, the biennial electronica exhibition in Munich, Germany, was grandly opened at the New International Expo Center in Munich, Germany. The exhibition, scheduled for November 12th to November 15th, 2024, stands as one of the premier events in the global electronics industry. It focuses on numerous cutting-edge fields such as automotive, wireless technology, medical electronics, and new energy, attracting over 3,000 exhibitors from around the world and more than 80,000 professional visitors, including technical experts and industry analysts. Yinte Electronics, as a mainstream semiconductor power device manufacturer in China, made its debut at this electronics industry event. Yinte Electronics

TOLL (Transistor Outline Leadless) packaged MOSFETs have been widely used in terminal applications such as electric bicycles, electric motorcycles, lithium battery protection, and communication power supplies due to their compact size, low package resistance, low parasitic inductance, and low thermal resistance characteristics. TOLL (Transistor Outline Leadless) package is an advanced power device packaging technology with multiple notable features and advantages. The following is a detailed analysis of the TOLL package: I. Basic Features

Source: Science and Technology News; About 20 years ago, Intel made the decision to change the course of computing history. In 2005, shortly after Apple installed Intel chips in Mac computers, Steve Jobs asked Paul Otellini, then CEO of Intel, if he was willing to supply iPhone processors, but was refused, causing a complete change in the future mobile computing architecture. Intel's decision 20 years ago enabled Arm to effectively monopolize chip design, with a market size in the mobile market that is more than twice that of the PC industry.

Author: Fusion Fusheng Electronic Link: https://zhuanlan.zhihu.com/p/713384511 Source: The copyright of Zhihu belongs to the author. For commercial reprints, please contact the author for authorization. For non-commercial reprints, please indicate the source. For decades, the narrative of the electronics manufacturing industry has revolved around giants such as China, South Korea, and Taiwan. However, Mexico is emerging as a new competitor. Mexico's electronics industry is experiencing significant growth, transforming the country into a powerhouse in areas such as semiconductors and artificial intelligence applications. Although the prospects are promising

On September 10th, the website of the General Administration of Customs showed that according to customs statistics, the total import and export value of China's goods trade (the same below) in the first eight months of 2024 was RMB 28.58 trillion, a year-on-year increase of 6%. In terms of export data, in the first 8 months, China's exports of mechanical and electrical products reached 9.72 trillion yuan, an increase of 8.8%, accounting for 59.1% of China's total export value. Among them, automatic data processing equipment and its components amounted to 942.38 billion yuan, an increase of 11.6%; Integrated circuits amounted to 736.04 billion yuan, an increase of 24.8%; Automobiles amounted to 540.84 billion yuan, an increase of 22.2%; Mobile phones reached 514.37 billion yuan, an increase of 0.5%. In terms of import data, the import of mechanical and electrical products reached 4.49 trillion yuan, an increase of 10.4%. Among them, there are 358 billion integrated circuits, an increase of 14.8%, with a value of 1.74 trillion yuan, an increase of 14%; There were 478000 cars, a decrease of 1.8%, with a value of 193.61 billion yuan, a decrease of 6.6%.

The wave of AI and artificial intelligence has propelled the global semiconductor industry out of the "haze" and ushered in significant growth, as evidenced by recent industry data disclosures. However, looking at the global development pattern of the semiconductor industry, the pace of development varies in different regions. The wave of semiconductor expansion in Europe and America is facing resistance, while the Southeast Asian market continues to rise. The global semiconductor market is mixed, with opportunities and challenges coexisting, and there are still plenty of highlights. AI driven, semiconductor market enters growth cycle Recently, the Semiconductor Industry Association (SIA) released data showing that the global semiconductor industry's cumulative sales in the second quarter of this year reached $149.9 billion, a year-on-year increase of 18.3% and a month on month increase of 6.5%. Among them, the monthly sales in June this year reached 50 billion US dollars, a year-on-year increase of 22.9% and a month on month increase of 1.7%. The industry points out that this is the highest global semiconductor growth rate since April 2022. The booming development of generative AI has driven an overall increase in demand for the semiconductor industry. The two major industries of memory and wafer foundry, driven by AI, are showing a positive development trend. In the field of memory, the application of AI generative large models brings benefits to both DRAM and NAND Flash: AI applications require the use of high-performance GPUs, and the demand for HBM related to it is skyrocketing. The latest survey by TrendForce, a global market research firm, shows that with the iteration of AI chips, the HBM (high bandwidth memory) capacity carried by a single chip has also significantly increased. Driven by the growth of AI chips and single-chip capacity, there has been a significant increase in the overall consumption of HBM in the industry. It is estimated that the annual growth rate will exceed 200% in 2024, and HBM consumption will double again by 2025. AI also requires flash memory products with higher storage capacity, and the attention to enterprise grade solid-state drives continues to increase. Jibang Consulting stated that due to the significant increase in demand for AI, AI server related customers have further requested suppliers to add Enterprise SSDs (Enterprise Solid State Drives) in the past two quarters. It is expected that the procurement capacity of AI related SSDs will exceed 45EB this year, and in the next few years, AI servers are expected to drive an average annual growth rate of SSD demand exceeding 60%. In order to meet the supply of SSD in AI applications and accelerate process upgrades, upstream suppliers have begun planning to launch 2YY products, which are expected to be mass-produced by 2025. In terms of wafer foundry, due to the increasing popularity of AI big model applications, the demand for AI chips is soaring, and advanced processes have become a "hot commodity", ushering in a wave of price increases and production expansion. At the beginning of this year, TSMC informed customers that the price of 5/3nm process products would increase in 2024. In late July, TSMC issued notices to multiple customers that the prices of 5/3nm process products would increase again from January 2025. Depending on different investment plans, products, and cooperation relationships, the increase would be around 3-8%. The booming development of advanced processes has attracted wafer fabs to accelerate the layout of 2nm, 1nm and other updated products. At the beginning of this year, TSMC informed customers that 5/3nm process products will increase in price in 2024. TSMC and Samsung plan to mass produce 2nm chips by 2025, while Rapidus plans to start trial production of 2nm chips in the same year. In addition, the industry is expected to see mass production of 1nm level chips from 2027 to 2030. Mixed emotions, global semiconductor development pace varies The development of the global semiconductor industry is fluctuating, with the current pace of semiconductor expansion in Europe and America slowing down due to factors such as subsidies and insufficient labor resources. At the same time, the semiconductor industry in Asia, represented by Southeast Asia, is accelerating. one Large factories face obstacles in expanding into the European and American markets The semiconductor projects of major companies such as TSMC, Samsung, and Intel in the European and American markets have been postponed. TSMC's first wafer fab in Arizona, USA, which was originally scheduled for mass production this year, has been postponed to the first half of 2025; The second local wafer fab is scheduled for mass production in 2026, but has been postponed until 2028. Intel will build two new cutting-edge wafer fabs in Ohio and plans to begin chip manufacturing in 2025. Due to the sluggish market and delayed subsidy payments in the United States, Intel has postponed the chip project. After adjustment, the Fab1 and Fab2 factories of Intel's Ohio One project will be postponed until 2026-2027 for completion, and will be officially put into operation around 2027-2028. In addition, Intel invested 30 billion euros to build Fab 29.1 and Fab 29.2 wafer fabs in Magdeburg, Germany, which were originally planned to start construction in the second half of 2023. However, due to the delayed confirmation of EU subsidies and the need to remove black soil from the construction area, Intel has postponed the start date to May 2025. Samsung's first wafer fab located in Taylor, Texas, was originally scheduled to start production in 2024, but media reports this year have postponed the production of the fab to 2026. According to the latest media reports, Samsung has proposed a large-scale investment plan to establish a storage chip factory in Texas, USA. However, the Office of Semiconductor Support Act of the US Department of Commerce has decided not to provide financial support related to this plan. Industry analysis suggests that this is equivalent to refusing Samsung's establishment of a storage chip factory in the United States. two The semiconductor industry in Southeast Asia is gradually rising The semiconductor industry in Southeast Asia has begun to take shape in the Asian market and is showing a rapid development trend. Malaysia and Singapore are typical representatives, while Vietnam is a new force. Malaysia plays an important role in the global semiconductor industry chain's packaging and testing end. According to incomplete statistics from Global Semiconductor Watch, about 50 semiconductor companies have successively set up back-end packaging and testing factories in Malaysia, including Intel, Micron, Texas Instruments, NXP, Sunlight, Anson Semiconductors, Infineon, Huatian Technology, Tongfu Microelectronics, Suzhou Gude, Renesas Electronics, Anson, Ankao, STMicroelectronics, etc. In May of this year, Malaysia announced a National Semiconductor Strategy (NSS), which will focus on the development of integrated circuit design, advanced packaging and manufacturing equipment, and storage chip fields. Singapore is a major semiconductor production hub in Southeast Asia, with a complete semiconductor industry chain covering design, manufacturing, packaging, testing, equipment, materials, distribution, and other aspects. Many semiconductor companies, including Texas Instruments, STMicroelectronics, Infineon, Micron, GlobalFoundries, TSMC, UMC, Vanguard, and Sun Moon, have set up branches or expanded factories in Singapore. Among them, wafer foundry leaders such as TSMC, Gexin, UMC, and World Advanced have built factories here, involving 8-inch and 12 inch factories. The semiconductor industry is one of the nine national level products in Vietnam and has been listed as one of the national development priorities for the next 30-50 years. According to the Draft Development Strategy for Vietnam's Semiconductor Microchip Industry, Vietnam plans to become a design, packaging, and testing center for the global semiconductor chip industry by 2030. At present, Vietnam has attracted foreign-funded enterprises such as Intel, Sunlight, Samsung Electronics, AnKou, Qualcomm, Anson, Renesas, TI, NXP Minmetals, Xinsi Technology, Hengnuo Microelectronics, Amperex, etc. The latest news shows that Vietnam has recently established the National Semiconductor Industry Development Guidance Committee. The main tasks and functions of the steering committee include assisting the Prime Minister and the government in researching and guiding, and cooperating in resolving important and cross departmental affairs related to promoting the development of Vietnam's semiconductor industry; Research, consult, and suggest directions and solutions to promote the development of Vietnam's semiconductor industry; Guide the cooperation among various departments, government agencies, relevant institutions, and organizations to effectively promote the development of Vietnam's semiconductor industry.

Xinhua News Agency reported that the "Decision of the Central Committee of the Communist Party of China on Further Comprehensively Deepening Reforms and Promoting Chinese Modernization" reviewed and adopted at the Third Plenary Session of the 20th Central Committee systematically deploys the improvement of the network comprehensive governance system, explicitly proposing to improve the development and management mechanism of generative artificial intelligence.
Zhuang Rongwen, Director of the Central Cyberspace Affairs Office, stated that actively promoting the development and management of generative artificial intelligence is an important duty of cyberspace work. We will adhere to coordinating high-quality development and high-level safety, promoting industrial development, technological progress, and safety assurance in this important field.
In recent years, generative artificial intelligence has developed rapidly, with new technologies continuously breaking through,

Recently, the Higher Education Department of the Ministry of Education stated its support for universities to lay out majors such as integrated circuits, artificial intelligence, and AI. The Higher Education Department of the Ministry of Education recently released a notice on the establishment of undergraduate majors in ordinary higher education institutions in 2024, which proposes to increase the adjustment of undergraduate majors and focus on optimizing the professional structure and talent training structure that are compatible with the new development pattern. The Notice clearly supports universities to lay out relevant majors in key fields such as integrated circuits, artificial intelligence, quantum technology, life and health, energy, green and low-carbon, foreign-related rule of law, international communication, international organizations, and financial technology, and to cultivate national strategic talents and urgently needed talents in a targeted manner. Support universities to deepen the construction of new engineering, new medicine, new agriculture, and new humanities, transform existing majors, cultivate emerging interdisciplinary majors, and create characteristic and advantageous professional clusters. Integrated circuits are the cornerstone of the development of the electronic information industry, and have extremely important strategic significance for enhancing national comprehensive strength and ensuring national security. Artificial intelligence (AI), as an important driving force for a new round of technological revolution and industrial transformation, has already exploded in popularity worldwide. In order to further promote the development of integrated circuits and artificial intelligence industries, major universities have established new colleges to provide advanced talents for the country. In terms of integrated circuits, Minister of Education Huai Jinpeng has previously stated that the Ministry of Education will cultivate a number of major scientific and technological projects around strategic, fundamental, and leading industries such as integrated circuits, industrial mother machines, instruments, and biomedicine, concentrate efforts on scientific research and further solve the problem of core technology bottlenecks. In order to cultivate high-precision talents in the industry and solve the bottleneck problem of core technology, many well-known universities in China have successively established integrated circuit colleges in recent years, including Peking University, Tsinghua University, Huazhong University of Science and Technology, Sun Yat sen University, Beijing University of Posts and Telecommunications, Guangdong University of Technology, Shandong University, Anhui University, Jiangsu University, Zhejiang University, South China University of Technology, Nanjing University of Posts and Telecommunications, Nanjing University of Information Science and Technology, and Hunan University Semiconductor College (Integrated Circuit College). In terms of artificial intelligence, more than 10 artificial intelligence colleges have been established in China since the beginning of this year, such as the School of Artificial Intelligence at Hunan University of Science and Technology, the School of Artificial Intelligence at Guangzhou University, the School of Artificial Intelligence and Data Science at the University of Science and Technology of China, the School of Artificial Intelligence at Harbin Institute of Technology, the School of Artificial Intelligence at Tsinghua University, the School of Artificial Intelligence at Shanghai Jiao Tong University, the School of Artificial Intelligence at the University of Electronic Science and Technology of China, the School of Artificial Intelligence at Beijing Forestry University, and the School of Artificial Intelligence at Shandong University. Among them, Yao Qizhi, a world famous computer scientist, Turing Prize winner and academician of the CAS Member, served as the first president of the School of Artificial Intelligence of Tsinghua University. In fact, in recent years, many colleges and universities in China have established AI colleges, research institutes or cross research centers, such as the University of the Chinese Academy of Sciences, Nanjing University, Peking University, etc. It is worth mentioning that strong universities such as Xi'an Jiaotong University, Beijing University of Posts and Telecommunications, and Huazhong University of Science and Technology have also established artificial intelligence colleges.