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Over the past decade, almost equivalent to the development decade of smartphones, a notable development trend is that many hardware functions can be realized through software iteration. Originally complex hardware performance is replaced by software that is easier to update and repair, and more advanced functions are added. This near "the later waves push the earlier waves" replacement trend is also evident in current hardware development.
However, implementing hardware functions through software also has obvious drawbacks. Compared to traditional hardware implementation, software is slower and consumes...

The BBC recently learned from a document claimed to be an internal ARM notification that SoftBank's well-known chip designer ARM may also have been involved in the dispute between Huawei and the U.S. government. According to the report, ARM has requested its employees in the notification to "suspend all ongoing contracts, support authorizations, and ongoing negotiations (with Huawei)," the reason being the U.S. Commerce Department's placement of Huawei on the Entity List. Although ARM is a UK company, the notification pointed out that it uses "technology originating from the United States," so the U.S. government ban is still effective for them.

According to the requirements mentioned in the notification, ARM...

Japanese media reported that under the background of Sino-US trade friction, Japanese magnetic technology holding company, which produces semiconductor materials and equipment components, chooses to continue high-level equipment investment targeting China.
According to the Japanese Economic News website on July 8, He Xianhan (phonetic), a senior executive of the Japanese magnetic technology holding company, was full of confidence in the prospects of the Chinese business at a recent financial report briefing.
The report stated that this confidence is reflected in the equipment investment plan. The company plans to increase equipment investment by 30% year-on-year in fiscal year 2019 to 48 billion yen (approximately 3 billion RMB), setting a record for a single year. Among them...

Our company participated in the 2019 China (Chengdu) Electronic Information Expo from July 11th to 13th, 2019, with booth number 4C254. We welcome new and old customers to visit and guide us!

Wuxi Daily reported that the team of Zhongkexin Integrated Circuit Co., Ltd. successfully overcame key technologies of wafer-level redistribution and wafer-level bump preparation. According to reports, the company's manufacturing platform based on wafer-level chip scale packaging technology has been mass-produced, providing manufacturing services for multiple domestic customers, filling the current gap in this field in China. Zhongkexin Integrated Circuit Co., Ltd. is a high-tech electronic enterprise established by China Electronics Technology Group Corporation, with a complete industrial chain including integrated circuit design, mask making, process, testing, packaging, reliability, and application. Products include FPGA SoC/MCU, radiation-resistant and...

Today, Huahong Semiconductor officially announced that its third-generation 90nm embedded flash (90nm eFlash) process platform has been successfully mass-produced.
According to reports, the Flash cell size of the third-generation 90nm embedded flash process platform is nearly 40% smaller than the second-generation process, setting a global record for the smallest size of embedded flash technology at the 90nm process node for foundries. The Flash IP has more area advantages, and the number of mask layers is further reduced. At the same time, in terms of reliability indicators, it can achieve 100,000 erase/write cycles and 25-year data retention.

Huahong Semiconductor...

ZTE and Huawei, as China's two major communications industry giants, have remarkable achievements in the 5G era, which is undeniable. Currently, both technology giants have invested substantial human, material, and financial resources in 5G research. After the three major operators successively announced the launch time of 5G phones, these two giants also announced their 5G commercial achievements. In this 5G era, who will be the final winner? We will wait and see.
In the mobile communications industry, both Huawei and ZTE are leaders. Recently, ZTE also released its 5G commercial achievements. Judging from the released results, ZTE has gradually emerged from the U.S. suppression incident...

Backup Strategy At the beginning of 2018, Hua Zheng from HiSilicon Shanghai R&D Institute participated in the department's Spring Festival symposium, summarizing the past fiscal year and listing the revenue of various departments and projects. He found that an optical communication chip project had only a tiny bit of revenue, negligible. This chip is used in backbone switches, with very little demand but high R&D costs. “From our perspective, it seems meaningless. This project must lose a lot of money. Just one tape-out costs over 20 million yuan.” Hua Zheng said, and a chip needs 3-4 tape-outs before mass production. Hua...