SiC Power Devices and High Temperature Reverse Bias
2023-07-28
Overview of SiC Power Devices
SiC (Silicon Carbide) power devices, with their characteristics of high temperature resistance, high voltage resistance, and low switching losses, can effectively achieve requirements such as high efficiency, miniaturization, lightweight, and high power density in power electronic systems, and are highly sought after in fields such as new energy vehicles, photovoltaic power generation, rail transportation, and smart grids.
In automotive applications, the significant advantages of SiC power devices in energy conversion efficiency can effectively increase the driving range and charging efficiency of electric vehicles. Additionally, SiC devices have lower conduction resistance, smaller chip size, and higher operating frequency, enabling electric vehicles to adapt to more complex driving...
The fusion of automotive sensors has encountered obstacles
2023-07-08
A key strategy of the fully autonomous vehicle is to be able to fuse inputs from multiple sensors, which is crucial for making safe and reliable decisions. However, it has proved to be much more difficult than initially thought.
There are many issues that need to be addressed, including how to divide, prioritize, and ultimately combine different types of data, as well as how to construct internal processing for the vehicle so that it can quickly make decisions based on these different data types to avoid accidents. There is no single best practice for achieving this goal, which is why many automotive original equipment manufacturers have taken vastly different approaches.
Celestial AI raises $100 million in Series B funding
2023-07-01
Celestial AI, based in Santa Clara, California, USA, is the creator of photonic structures. The company received $100 million in Series B funding, led by IAG Capital Partners, Koch Disruptive Technologies (KDT), and Temasek's Xora Innovation Fund.
Other major investors in this round of financing include Samsung Catalyst, Smart Global Holdings (SGH), Porsche Automobile Holding SE, the Engine Fund, and imec. Expansion, M Ventures, and Tyche Partners. The optical connectivity performance level provided by Celestial AI's photonic structure technology platform is reportedly ten years ahead of existing technology products.
Celestial AI states that the era of electronic connections limiting data transmission is coming to an end, as optical interconnects become the fundamental building blocks for accelerating computing. Today's advanced artificial intelligence (AI) models require exponential growth in memory capacity and bandwidth, as large language models (LLMs), including GPT-4 used for ChatGPT and recommendation engines, are memory constraints rather than computational constraints. Cloud service providers (CSPs) and hyperscale data centers are unable to separate memory expansion from computing (often referred to as the "memory wall" challenge). Low bandwidth, high latency, and high-power electrical interconnection are important obstacles to the growth of profitable business models and progress in artificial intelligence. Therefore, Optical Computing Interconnection (OCI) is considered the only feasible solution for implementing scalable data center memory decomposition and accelerating computation. In addition, the pool storage system of optical interconnection solves the biggest factor causing low economic efficiency in data centers - stranded memory.
After closely collaborating with hyperscale, artificial intelligence computing, and memory providers, Celestial AI has launched Photonic Fabric, an optical interconnect for decomposition, billions of computations, and memory clusters. It is said that the photonic structure is not constrained by the packaging seaside restrictions and can transmit data to any location on the computing chip, directly to the consumption point. The bandwidth provided by photonic structures is 25 times higher than any alternative optical interconnect solution, such as co packaged optical devices (CPO), with latency and power consumption reduced by more than 10 times.
Dave Lazovsky, founder and CEO of Celestial AI, stated, "Generative artificial intelligence and recommendation engines running on general-purpose computing systems are starting to have a significant impact on business processes, products, and services." "With the global data center infrastructure shifting from general-purpose to accelerated computing systems, there will be a rapid transformation in the coming years. The architecture of the next wave of data center infrastructure aims to achieve the decomposition of memory and computing resources through optical interconnects, making significant progress in AI workload efficiency
Celestial AI is building a powerful photonic structure ecosystem consisting of AI computing, memory suppliers, hyperscale suppliers, and a large number of commercial supply chain partners. This technology is compatible with existing industry standards, including CXL, PCIe, UCIe, JEDEC HBM, and proprietary electrical communication links. Celestial AI offers its photonic structure optical interconnect technology and silicon validated IP through a technology licensing program.
Celestial AI has developed a transformative optical connectivity capability that will achieve a leap forward in performance and energy efficiency in high-performance computing, unleashing the potential of native AI and other complex workloads, "commented Chase Koch, founder and CEO of Koch Disruptive Technologies. He believes that "this may be a truly disruptive moment for advanced computing
Celestial AI provides a set of photonic structure technology solutions to provide independent computing and memory resource scalability. Customers can extend their existing computing platforms (GPUs, CPUs, and accelerators) with photonic structures through authorized IPs, or utilize the full end-to-end advantages of photonic structures through Celestial AI's Orion AI Accelerator. The photonic structure also supports the production deployment of the industry's first optical interconnect high-capacity, high bandwidth combinable storage system.
News: Optoelectronics

