News & Events

On September 27, 2022, California time, SEMI announced in its latest quarterly World Fab Forecast that global fab equipment spending is expected to increase by approximately 9% year-on-year in 2022, reaching a historic high of $99 billion. After reaching record levels in 2022, it is expected that the global wafer fab equipment market will continue to maintain healthy development next year, driven by the construction and upgrading of new wafer fabs, "said Ajit Manocha, President and CEO of SEMI It is estimated that Taiwan, China will lead the expenditure on wafer factory equipment in 2022, with an increase of 47% year-on-year to 30 billion US dollars. Next is South Korea, reaching 22.2 billion US dollars, a decrease of 5.5%. China's value is 22 billion US dollars, a decrease of 11.7% from last year's peak. It is expected that expenditures in the Europe/Middle East region will reach a record high of $6.6 billion this year, a year-on-year increase of 141%. Despite relatively low expenditures compared to other regions, strong demand for advanced high-performance computing (HPC) technologies is driving a surge in expenditures in the region. It is expected that investment in the Americas and Southeast Asia will also reach historic highs in 2023. The semiconductor industry's production capacity continues to increase According to the SEMI World Fab Forecast, global production capacity is expected to increase by 7.7% this year, following a 7.4% growth in 2021. The last time wafer fab equipment experienced an 8% year-on-year growth was in 2010, when the monthly production capacity exceeded 16 million wafers (equivalent to 8 inches), which is approximately half of the expected 29 million wafers per month in 2023. It is expected that production capacity will continue to grow by 5.3% in 2023. In 2022, the capacity growth of 167 wafer fabs and production lines will account for over 84% of equipment expenditure. With the increase in capacity of 129 known wafer fabs and production lines, it is expected that this proportion will decline to 79% next year. As expected, the Foundry segment will account for 53% of device spending in 2022 and 2023, followed by memory, which will account for 32% and 33% respectively. These two areas have the largest increase in production capacity. The latest World Fab Forecast report released this time lists 1453 factories and production lines worldwide, including 148 factories and production lines expected to start production in 2022 or later.

Yin Te Electronics has developed a TVS device for 5G application scenarios, which provides a clamping voltage lower than the avalanche voltage but higher than the rated operating voltage. The LSPD6/LSPD10 series provides excellent clamping characteristics. Therefore, any boost caused by current conduction can be suppressed to the lowest level, providing optimal protection. In addition, the component can be connected in series and/or parallel to create a solution with various functions and flexible protection. The base station power line protection device helps to avoid service interruptions to users, improve system reliability, and reduce maintenance costs. Wireless network base stations require protection against overvoltage and overcurrent caused by lightning, power line accidents, and other interferences. Base stations are often located in remote and lightning prone areas, where quick and effective maintenance is difficult and expensive. Using appropriate protective circuits and devices will reduce the risk of damage. Risks and Protection of Power Input Lines The main sources of danger for wireless network base stations are lightning and power failures. Directly striking or approaching the transmission tower can generate high voltage and cause huge currents to flow through the transmission line. Similar impacts can cause short circuits and switch transients in high-voltage transmission lines. The damage caused by this will result in repair time, service downtime, and customer interruption. The most suitable protective measures for these transmission lines are to install fuses and high-power TVS diodes in the AC distribution box.

The National Standardization Administration website released the "2021 No. 17 Chinese National Standard Announcement" on December 31, 2021, and the new national standard for driving recorders (GB/T19056-2021) has been officially released, with a clear implementation date of July 1, 2022 Car driving recorder, commonly known as car black box, is a digital electronic recording device that records, stores, and can output data related to the vehicle's driving speed, time, mileage, and other status information through an interface Our company's several types of products will be applied to car recorders: 1. Car power input terminal 12V system SM8S24A or SM8S24CA 2. The 24V input terminal of the car power supply system SM8S33A or SM8S33CA DC-DC withstand voltage exceeds 60V, and SM8S36A or SM8S36CA can be selected 3. Schottky diodes in anti reverse and BUCK circuits: SK56/SMC SS110 SS210/SMA 4. ESD protection for USB or SIM cards is: ESDLSCRRV05-4 Welcome to discuss with technical and related R&D personnel, and also welcome to come to the Yin Te Laboratory for verification and experimental testing (free of charge)

Recently, there have been major updates Standard for Electrical Design of Civil Buildings GB 51348-2019 (implemented on August 1, 2020) Energy Efficiency Limits and Grades for Power Transformers GB 20052-2020 (implemented on June 1, 2021) General Part of Electric Shock Protection Devices and Equipment GB/T 17045-2020 (implemented on October 1, 2021) Technical Standard for Fire Emergency Lighting and Evacuation Indication System GB 51309-2018 (implemented on March 1, 2019) General Rules for the Equipping and Management of Energy Measuring Instruments in Energy using Units GB 17167-2006 (implemented on January 1, 2007) Green Building Evaluation Standard GB/T 50378-2019 (implemented on August 1, 2019) Electromagnetic Environment Control Limits GB 8702-2014 (implemented on January 1, 2015) Guidelines for Economic Evaluation of Energy Efficiency Technology of Distribution Transformers DL/T 985-2012 (implemented on July 1, 2012) Technical Regulations for Urban Lighting Automatic Control System CJJ/T 227-2014 (implemented on May 1, 2015) Technical Standard for Electrical and Automation Engineering of Urban Drainage System CJJ/T 120-2018 (implemented on March 1, 2019) Design Standards for Research Buildings JGJ 91-2019 (implemented on January 1, 2020) Design Standard for Office Buildings JGJ/T 67-2019 (implemented on March 1, 2020) Construction and Acceptance Standards for Automatic Fire Alarm Systems GB 50166-2019 (implemented on March 1, 2020) Design Standard for Boiler Room GB 50041-2020 (implemented on July 1, 2020) Green Design Standards for Public Buildings in Shanghai DG/TJ 08-2139-2018 (implemented on July 1, 2019) Green Design Standards for Residential Buildings in Shanghai "DG/TJ 08-2143-2018 (implemented on July 1, 2019) Technical Standards for 5G Mobile Communication Infrastructure in Zhejiang Province Construction Projects DB 33/1239-2021 (implemented on May 1, 2021) Jiangsu Province Residential Design Standards DB 32/3920-2020 (implemented on July 1, 2021, revised to replace Residential Design Standards DGJ32/J 26-2017) The "Operational Technical Guidelines for Difficult Issues in Zhejiang Fire Protection Technical Specifications (2020 Edition)" Zhe Xiao [2020] No. 166 (implemented on March 1, 2021, and simultaneously abolished the "Operational Technical Guidelines for Difficult Issues in Zhejiang Fire Protection Technical Specifications" (Zhe Gong Tong Zi [2017] No. 89) in 2017 and the "Supplementary Technical Requirements for Building Smoke Control and Exhaust Systems" (Emergency Zhe Xiao [2019] No. 72) in 2019) Technical Standard for Automobile Refueling, Gas Filling and Hydrogen Refueling Stations GB 50156-2021 (implemented on October 1, 2021) Design Standard for Cold Storage GB 50072-2021 (implemented on December 1, 2021) Technical Standard for Public Broadcasting System Engineering GB/T 50526-2021 (implemented on October 1, 2021) GB/T 16895.10-2021 "Low voltage electrical installations - Part 4-44: Safety protection against voltage and electromagnetic disturbances" (implemented on May 1, 2022)

GaN Protect Gallium Nitride Integrating multiple power electronic devices onto a gallium nitride chip can effectively improve product charging speed, efficiency, reliability, and cost-effectiveness. GaN gallium nitride is the key to improving the overall system performance, creating circuit components that approach the "ideal switch" - a circuit component that can convert the minimum energy digital signal into lossless power transmission. Both "full bridge" and "half bridge" circuit designs can be supported by gallium nitride power chips. Gallium nitride power chips have a highly applicable power range and functionality, covering mobile fast chargers, data centers, consumer markets, renewable energy, and electric vehicles/electric vehicles. Their advantages can be highlighted in various applications ranging from tens of watts to over kilowatts! The GaN Protect team is developing a new generation of power protection devices, embedded modules, and standalone applications! Theoretical advantages of GaN Protect: Smaller size: GaN Protect devices can achieve charging speeds 2.7 to 3 times faster than traditional silicon chips, with only half the size and weight of the former. In terms of energy savings, it can save up to 40% of energy. Faster speed: The integrated design of gallium nitride power IC makes it very easy to use. The layout and control are very simple through simple "digital input, power output" operations. More environmentally friendly: Due to the small die size, fewer manufacturing process steps, and functional integration, the carbon dioxide emissions during the manufacturing of gallium nitride power chips are 10 times lower than those of charging solutions for silicon devices. Reliability: GaN Protect devices comply with the dual carbon policy, have lower internal resistance, and will generate less heat, resulting in lower risk What is GaN Protect? It is a trademark registered by the R&D team of Yin Te, which uses GaN material to protect devices!

The auspicious star shines brightly, and the purple qi points to the new beam. The headquarters of Yin Te Electronics has recently relocated to a new location and officially moved into a brand new office space. The new office covers various functional modules such as marketing and sales, supply chain, after-sales service, administrative finance, technology research and development, EMC laboratory, etc. The new address is located in Shuimu Park, Qidicaohejing (Zhongshan) Science and Technology Park, Guangfulin East Road, Songjiang District, Shanghai, in the G60 Yangtze River Delta Science and Technology Innovation Corridor. Qidi Caohejing (Zhongshan) Science and Technology Park is jointly built by Qidi Holdings, a subsidiary of Tsinghua University, Shanghai Lingang Group, and the Songjiang District Government of Shanghai. It is committed to becoming the driving force of the G60 Science and Technology Innovation Corridor in the Yangtze River Delta. A new beginning, a new journey. Taking advantage of the 15th anniversary of its establishment, the opening of the new office has put Yin Te Electronics on a bigger and stronger new starting line, marking the beginning of a new and magnificent chapter! The new office has a unique geographical location, convenient transportation, further upgraded hardware facilities and software environment, and more complete functional division, which will add wings and colors to the company's development! Fifteen years of wind and rain, forging ahead to write the Spring and Autumn Annals. Every step in the development of Yin Te Electronics is solid and powerful, which cannot be achieved without the joint efforts of all colleagues, and even more importantly, the support and trust of our customers and partners. I hope that in the future, we can continue to cooperate sincerely, work together, and achieve a better future. Experience different landscapes from different heights. Based on a new starting point and embarking on a new journey, Yin Te Electronics is sure to create a more brilliant and beautiful tomorrow!

On July 19, 2006, Yin Te Electronics was founded in Shanghai. Happy 15th birthday! Yin Te, "Yin" sounds like "Ying" - I hope there will be innovation from Intel, 'Te' - I hope to have a strong focus.

According to reports, Renesas Electronics of Japan officially announced today that it will acquire Apple's chip supplier, Dialog Semiconductor. The two companies announced in a statement that Renesas Electronics will acquire Dialog Semiconductor for approximately 4.9 billion euros (approximately 5.9 billion US dollars) in cash, equivalent to 67.50 euros per share. Dialog Semiconductor has agreed to the terms of the transaction. The acquisition price is a 20% premium over Dialog Semiconductor's closing price of 56.12 euros last Friday. Since the beginning of the year, the stock price of Dialog Semiconductor has risen by about 25%, mainly due to strong demand for Apple's 5G phones and the stimulation of the sale of the company. Recently, it was reported that Dialog Semiconductor is in talks with potential acquirers, including Renesas Electronics. According to informed sources at the time, in addition to Renesas Electronics, Dialogue Semiconductor was still in negotiations with STMicroelectronics. Since last year, there has been a large-scale consolidation in the global semiconductor market, including Nvidia's $40 billion acquisition of British chip manufacturer ARM, AMD's $35 billion acquisition of semiconductor manufacturer Xilinx, ADI's $21 billion acquisition of Maxim, chip supplier Marvel Technology's $10 billion acquisition of semiconductor company Inphi, and SK Hynix's $9 billion acquisition of Intel's memory division. According to data, the transaction volume involving semiconductor companies more than doubled last year, reaching 144 billion US dollars. Currently, Renesas Electronics has a market value of approximately $20.5 billion and is one of the world's largest suppliers of automotive semiconductors, with European offices in the UK and Germany. In 2019, Renesas Electronics completed the acquisition of Integrated Device Technology (IDT) in the United States. This transaction is worth over $6 billion and will help Renesas Electronics expand beyond the automotive industry. Dialog Semiconductor and Renesas Electronics have been collaborating for over a decade. Dialog Semiconductor focuses on designing power management chips and announced in August last year that it would collaborate with Renesas Electronics on automotive computing platforms. Currently, there is a tense situation in global semiconductor supply, with Dialogue Semiconductor and Renesas Electronics also involved. Insiders stated in November last year that Apple is working hard to address the shortage of power management chips for iPhones and other devices. In the automotive industry, semiconductor shortages are forcing car manufacturers to shut down and making their relationships with chip suppliers tense. Like Dialog Semiconductor, Renesas Electronics is also a supplier to Apple. According to reports, Apple had planned to acquire Renesas SP Drivers (55% owned by Renesas) in 2014, but it was later acquired by Synaptics. Ruili Technology provides LCD chips for iPhone screens. Analysts say that due to the increasing protection of strategic industries such as semiconductors in various countries, this transaction is likely to be investigated. Currently, Nvidia's acquisition of ARM is under review by UK regulatory authorities! (From Xunshi Information)

The International Electrotechnical Commission (IEC) hopes that multi-purpose USB Type-C cables can reduce resource waste while bringing greater convenience to consumers. Nowadays, Type-C has been widely used and has high applicability and convenience, with many characteristics. Here are two examples: